surmount tm schottky diodes: cross - over quad series, ultra - small 600 m surface - mount chip rev. v1 mads - 002545 - 1307 series 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? ultra low parasitic capacitance and inductance ? surface mountable in microwave circuits , no wire bonds required ? rugged hmic construction with polyimide scratch protection ? reliable, multilayer metallization with a diffusion ? barrier, 100% stabilization bake (300c, 16 hours ) ? lower susceptibility to esd damage description and applications the mads - 002545 - 1307 series surmount silicon schottky cross - over quad diodes are fabricated with the patented heterolithic microwave integrated circuit (hmic) process. hmic circuits consist of silicon pedestals which form diodes or via conductors embed- ded in a glass dielectric, which acts as the low disper- sion, low loss, microstrip transmission medium. the combination of silicon and glass allows hmic devices to have excellent loss and power dissipation character- istics in a low profile, reliable device. these surmount schottky devices are excellent choices for circuits requiring the small parasitics of a beam lead device coupled with the superior mechanical performance of a chip. the surmount structure em- ploys very low resistance silicon vias to connect the schottky contacts to the metalized mounting pads on the bottom surface of the chip. these devices are reli- able, repeatable, and a lower cost performance solu- tion to conventional devices. they have lower suscepti- bility to electrostatic discharge than conventional beam lead schottky diodes. the multi - layer metallization employed in the fabrica- tion of the surmount schottky junctions includes a plati- num diffusion barrier, which permits all devices to be subjected to a 16 - hour non - operating stabilization bake at 300c. the 0202 outline allows for surface mount placement and multi - functional polarity orientations. the mads - 002545 - 1307 series is recommended for use in micro- wave circuits through ku band frequencies for lower power applications such as mixers, sub - harmonic mix- ers, detectors and limiters. the hmic construction fa- cilitates the direct replacement of more fragile beam lead diodes with the corresponding surmount diode, which can be connected to a hard or soft substrate cir- cuit with solder. inches millimeters dim. min. max. min. max. a 0.023 0.025 0.575 0.625 b 0.023 0.025 0.575 0.625 c 0.004 0.008 0.102 0.203 d sq. 0.007 0.009 0.175 0.225 e sq. 0.007 0.009 0.175 0.225 top view side view ordering information part number package mads - 002545 - 1307lg low barrier die in carrier mads - 002545 - 1307mg medium barrier die in carrier mads - 002545 - 1307hg high barrier die in carrier a b d e d c a b d e d c
surmount tm schottky diodes: cross - over quad series, ultra - small 600 m surface - mount chip rev. v1 mads - 002545 - 1307 series 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 schematic (equivalent circuit) electrical specifications: freq. = dc - 18 ghz, t a = +25c 1,2 1. r t is the dynamic slope resistance where r t = r s + r j , where r j = 26 / i dc (i dc is in ma) and r s is the ohmic resistance. 2. maximum forward voltage difference dvf @ 1 ma: 10 mv parameter absolute maximum forward current 20 ma reverse voltage 5 v rf cw incident power 20 dbm rf & dc dissipated power 50 mw junction temperature +175c operating temperature - 40c to +125c storage temperature - 40c to +150c absolute maximum ratings 3,4 model number barrier v f @ 1 ma (mv) ct @ 0 v (pf) r t slope resistance (v f 1 - v f 2) / (10.5 ma - 9.5 ma) ( ) mads - 002545 - 1307l low 330 max. 305 typ. 0.22 max. 0.11 typ. 11 typ. 20 max. mads - 002545 - 1307m medium 470 max. 390 typ. 0.22 max. 0.11 typ. 11 typ. 18 max. mads - 002545 - 1307h high 700 max. 650 typ. 0.22 max. 0.11 typ. 9 typ. 15 max. handling procedures please observe the following precautions to avoid damage: static sensitivity these electronic devices are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these class 0 devices. 3. exceeding any one or combination of these limits may cause permanent damage to this device. 4. macom does not recommend sustained operation near these survivability limits.
surmount tm schottky diodes: cross - over quad series, ultra - small 600 m surface - mount chip rev. v1 mads - 002545 - 1307 series 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 handling procedures all semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. the top surface of the die has a protective polyimide coating to minimize damage. the rugged construction of these surmount devices allows the use of standard handling and die attach techniques. it is important to note that industry standard electrostatic discharge (esd) control is required at all times, due to the sensitive nature of schottky junctions. bulk handling should insure that abrasion and mechanical shock are minimized. die bonding die attach for these devices is made simple through the use of surface mount die attach technology. mounting pads are conveniently located on the botto m surface of these devices, and are opposite the active junction. the devices are well suited for high temperature solder attachment onto hard substrates. 80au/20sn and sn63/pb36 solders are acceptable for usage. for hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads of the device. when soldering to soft substrates, it is recommended to use a lead - tin interface at the circuit board mounting pads. position the die so that its mounting pads are aligned with the circuit board mounting pads. reflow the solder paste by applying equal heat to the circuit at both die - mounting pads. the solder joint must not be made one at a time, creating un - equal heat flow and thermal stress. solder reflow should not be performed by causing heat to flow through the top surface of the die. since the hmic glass is transparent, the edges of the mounting pads can be visually inspected through the die after die attach is completed. circuit mounting dimensions (inches) 0 . 0 1 2 0 . 0 1 2 0 . 0 1 2 0 . 0 1 2 0 . 0 1 2 0 . 0 1 2 0 . 0 0 9 0 . 0 0 9
surmount tm schottky diodes: cross - over quad series, ultra - small 600 m surface - mount chip rev. v1 mads - 002545 - 1307 series 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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